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Special Processes

1+N+1 Structure (L1-2;L5-L6;L9-L10) 10 Layers POFV HDI Printed Circuit Board1+N+1 Structure (L1-2;L5-L6;L9-L10) 10 Layers POFV HDI Printed Circuit Board
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1+N+1 Structure

1+N+1 Structure (L1-2;L5-L6;L9-L10) 10 Layers POFV HDI Printed Circuit Board

10 Layers 1+N+1 Structure (L1-L2;L3-L8;L9-L10) Epoxy Filled Vias OSP PCB10 Layers 1+N+1 Structure (L1-L2;L3-L8;L9-L10) Epoxy Filled Vias OSP PCB
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1+N+1 Structure

10 Layers 1+N+1 Structure (L1-L2;L3-L8;L9-L10) Epoxy Filled Vias OSP PCB

10 Layers Buried Resistance ENIG+Hard Gold (Gold Finger) POFV Multilayer PCB10 Layers Buried Resistance ENIG+Hard Gold (Gold Finger) POFV Multilayer PCB
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10 Layers PCB

10 Layers Buried Resistance ENIG+Hard Gold (Gold Finger) POFV Multilayer PCB

10 Layers Panasonic Megtron6 1+N+1 Structure (L1-4;L4-7;L7-10) ENIG HDI High Speed PCB10 Layers Panasonic Megtron6 1+N+1 Structure (L1-4;L4-7;L7-10) ENIG HDI High Speed PCB
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1+N+1 Structure

10 Layers Panasonic Megtron6 1+N+1 Structure (L1-4;L4-7;L7-10) ENIG HDI High Speed PCB

14 Layers Hard Gold 35u & ENIG 1u POFV HDI PCB Board
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12+ Layers PCB

14 Layers Hard Gold 35u & ENIG 1u POFV HDI PCB Board

14 Layers Rogers 4350B+FR4 TG170 Hybrid Lamination POFV ENIG Rigid PCB14 Layers Rogers 4350B+FR4 TG170 Hybrid Lamination POFV ENIG Rigid PCB
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12+ Layers PCB

14 Layers Rogers 4350B+FR4 TG170 Hybrid Lamination POFV ENIG Rigid PCB

16 Layers Backdrill Industrial Motherboard 2.9mil Line Spacing High TG PCB16 Layers Backdrill Industrial Motherboard 2.9mil Line Spacing High TG PCB
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12+ Layers PCB

16 Layers Backdrill Industrial Motherboard 2.9mil Line Spacing High TG PCB

3+N+3 Structure (L1-2;L1-3;L1-5;L5-6;L6-10;L8-10;L9-10) Matte Green HDI PCB3+N+3 Structure (L1-2;L1-3;L1-5;L5-6;L6-10;L8-10;L9-10) Matte Green HDI PCB
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10 Layers PCB

3+N+3 Structure (L1-2;L1-3;L1-5;L5-6;L6-10;L8-10;L9-10) Matte Green HDI PCB

4 Layers 1+N+1 Structure (L1-2;L2-3;L3-4) ENIG 2u POFV HDI PCB4 Layers 1+N+1 Structure (L1-2;L2-3;L3-4) ENIG 2u POFV HDI PCB
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1+N+1 Structure

4 Layers 1+N+1 Structure (L1-2;L2-3;L3-4) ENIG 2u POFV HDI PCB

4 Layers Both Sides Plated Half Holes Immersion Gold 1u Rigid Blue PCB4 Layers Both Sides Plated Half Holes Immersion Gold 1u Rigid Blue PCB
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4 Layers PCB

4 Layers Both Sides Plated Half Holes Immersion Gold 1u Rigid Blue PCB

4 layers ENIG 1u Conductive Via Fill (POFV) Green PCB4 layers ENIG 1u Conductive Via Fill (POFV) Green PCB
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4 Layers PCB

4 layers ENIG 1u Conductive Via Fill (POFV) Green PCB

6 Layers Matte Green Edge Plating SYTech S1000-2M ENIG 1u Multilayer PCB6 Layers Matte Green Edge Plating SYTech S1000-2M ENIG 1u Multilayer PCB
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Edge Plating

6 Layers Matte Green Edge Plating SYTech S1000-2M ENIG 1u Multilayer PCB

6 Layers Nelco N4103-13EP CE Material Sequential lamination POFV ENIG 1u PCB6 Layers Nelco N4103-13EP CE Material Sequential lamination POFV ENIG 1u PCB
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High Frequency PCB

6 Layers Nelco N4103-13EP CE Material Sequential lamination POFV ENIG 1u PCB

8 Layers 2+N+2 Structure (L1-2;L1-3;L3-6;L6-8;L7-8) POFV ENIG 2u HDI PCB8 Layers 2+N+2 Structure (L1-2;L1-3;L3-6;L6-8;L7-8) POFV ENIG 2u HDI PCB
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2+N+2 Structure

8 Layers 2+N+2 Structure (L1-2;L1-3;L3-6;L6-8;L7-8) POFV ENIG 2u HDI PCB

8 Layers Blind Via(L1-L2;L7-L8) Conductive Via Fill Impedance Control PCB8 Layers Blind Via(L1-L2;L7-L8) Conductive Via Fill Impedance Control PCB
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Blind/Buried Via

8 Layers Blind Via(L1-L2;L7-L8) Conductive Via Fill Impedance Control PCB

Advanced 8 Layers Optical Module Step Gold Finger Megtron7 High Speed PCBAdvanced 8 Layers Optical Module Step Gold Finger Megtron7 High Speed PCB
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8 Layers PCB

Advanced 8 Layers Optical Module Step Gold Finger Megtron7 High Speed PCB

Advanced Buried Capacitance 12 Layers High Density Interconnections PCBAdvanced Buried Capacitance 12 Layers High Density Interconnections PCB
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1+N+1 Structure

Advanced Buried Capacitance 12 Layers High Density Interconnections PCB

Advanced Double Side Aluminum-Based Plated Half Holes ENIG 1u White PCBAdvanced Double Side Aluminum-Based Plated Half Holes ENIG 1u White PCB
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Aluminum-Based PCB

Advanced Double Side Aluminum-Based Plated Half Holes ENIG 1u White PCB

All Around Plated Half Holes Conductive Via Fill (POFV) ENIG 2u 8 Layers PCBAll Around Plated Half Holes Conductive Via Fill (POFV) ENIG 2u 8 Layers PCB
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8 Layers PCB

All Around Plated Half Holes Conductive Via Fill (POFV) ENIG 2u 8 Layers PCB

Both Sides Plated Half Holes Small Format 4 Layers ENIG 1u Rigid Green PCBBoth Sides Plated Half Holes Small Format 4 Layers ENIG 1u Rigid Green PCB
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4 Layers PCB

Both Sides Plated Half Holes Small Format 4 Layers ENIG 1u Rigid Green PCB

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