Double-sided immersion gold PCB applications Immersion gold process PCB (Printed Circuit Board) is a widely used substrate in electronic manufacturing, it has excellent electrical properties, mechanical properties and thermal stability. Among them, double-sided gold-immersed PCB has significant advantages in the production of high-precision, high-reliability electronic equipment. This article will introduce the application of double-sided immersion […]
Category Archives: PCB Design
PCB Design
Uncover the magic of PCB step holes and step slots! Overview of the importance and function of pcb step holes and step slots Step holes and step slots are two important elements in the design and manufacture of PCB (Printed Circuit Boards). They each have unique functions and roles, and play a key role in […]
Multi-level impedance PCB revealed, signal quality soars on it! Multi-level impedance PCB is a special kind of PCB design, which achieves better signal quality and more stable circuit performance by using different impedance lines in the board. Below we will introduce the design and advantages of multilevel impedance PCB in detail from the following aspects. […]
How do thick copper circuit board suppliers follow strict design specifications to ensure quality? Suppliers of thick copper circuit boards need to follow a number of design specifications to ensure that the boards supplied meet industry standards and customer requirements. The following are some of the design specifications that need to be followed: Size and […]
The secret behind multilayer PCB design is out in the open! Multilayer PCB design principles to follow With the rapid development of the electronics industry, multilayer PCB has become a core part of many electronic devices. When designing multilayer PCBs, certain principles must be followed to ensure their reliability, stability and performance. This article will […]
8 layers PCB boards, art in design, you need to know 8 layers PCB board is a kind of multilayer PCB, whose stacked layer structure is realized by combining and designing the materials. When assigning the stacked layer structure, it is necessary to consider factors such as signal quality, power distribution, and grounding protection to […]