The challenge for thick copper pcb manufacturers: overcoming pcb surface defects and dimensional deviations
- Plate surface defects: the surface of thick copper pcb may have various defects, such as cracks, inclusions, bumps, depressions, etc.. These defects not only affect the aesthetics of the plate, but also may have an impact on its performance. 2.
- plate size deviation: due to the thick material of thick copper pcb, the processing process is prone to size deviation, resulting in the thickness, length, width and other parameters of the plate does not meet the standard.
- plate bending deformation: thick copper pcb in the processing process, due to the role of bending force, easy to bend deformation, affecting its flatness and performance.
- Difficulty of plate welding: due to the thicker material of thick copper pcb, welding requires higher temperature and greater pressure, which can easily lead to poor welding or uneven welds and other problems.
- High production costs: the production of thick copper pcb requires a large amount of raw materials and energy, coupled with the difficulty of its processing, so the production cost is high.
In order to solve these problems, thick copper pcb manufacturers need to strengthen the quality control of raw materials, optimize the processing technology, improve the precision and stability of production equipment, but also need to strengthen the technical training of employees and management level. Only in this way can we produce high-quality, high-performance thick copper pcb products.
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