Clients With Proof Of Cooperation
Over 18500+ businesses and innovators use PEAK PCB
Raw Material Suppliers
More than 21+ raw material brands, 230+ raw material types
Who is PEAK?
Founded in 2007, PEAK Co.,Ltd is an electronic solutions company offering 1-64 layers PCB fabrication, assembly, testing & validation of rigid, rigid-flex, HDI, high frequency, high speed, metal core, IC substrate, substrate-like and other special PCB. Our modern 54,000 square foot manufacturing facility allows us to provide all rigid & rigid-flex services under one roof and offer quick-turn capabilities. PEAK has a professional reputation for developing high-performance solutions for technically advanced OEM’s in a variety of markets including aerospace and defense, medical, computer, communication, server, semiconductor IC, automotives, industrial control, optoelectronics, LED and others.
Ability to Handle Complex Jobs
All Rigid & Rigid-Flex Services Under One Roof
Regular PCB
Up to 64 Layers; FR4 TG135/TG150/TG170; Halogen Free/CTI≥600; Aspect Ratio (Finish Hole) 28:1; Sample Expedited 8 Hours(1-2Layer);
Metal Core PCB
Thermal Conductivity 1-398W/m.K; Aluminum/Copper AC 500-4000V; Post-bonding/Pre-bonding; Sweat-Soldering/Conductive Adhesive; Press-Fit/Embedded Coin(I, T U);
HDI PCB
Blind/Buried/Hybrid Via; 5+N(N+M)+5 Structure; Trace Width/Spacing 1.6/1.6mil; Laser Hole Size(mm)≥0.075; High Density Interconnector;
Rigid-Flex PCB
2-24 Layers; Book/Air-gap/Fly-tail; Unsymmetrical/Semi-Flex; Width of Flexible Zone 3mm(min); Dimension Accuracy ±0.05mm(min);
High Frequency PCB
More than 85+ Types; Rogers/Arlon/Taconic/Isola/ Nelco/F4B Serices,etc; Materials can be Specified; Impedance Tolerance ±5%(min);
Substrate PCB
CSP/FC-CSP/SIP/FC-BGA/WB-CSP; FR4/BT/High-Speed Material; Trace Width/Space 12/12μm; SM Registration:±20μm; Strict SM Flatness Control ≤5μm;
High Speed PCB
Panasonic Megtron4/6/7; TU-872SLK/Isola-FR408HR,etc; Impedance Tolerance ±5%(min); Dimension Accuracy ±0.02mm(min); Line Width/Space Accuracy ±5%;
Specialty PCB
Ceramic/Glass Material; Hybrid Material Lamination; Buried Capacitance/Resistance; PTH/NPTH Step Slots; Uneven/Segmented/Step Gold Finger;
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